Products Details
Young Soul
CLIP BONDER
Feature:
TO series,Bridge series,SOP/DFNseries,SMD series,PVModule series
Integrated design by automatic high speed highaccuracylinear/turret type die bonding,dispens.ing,visioninspection,automatic cutting clipsystem,vacuum reflow oven that is a perfectreplacement foraluminum wire bonding andcopperwire bonding process, product cycletime and processes wil be reduced and will begreatlyimprove production efficiency.
TO series,Bridge series,SOP/DFNseries,SMD series,PVModule series
Integrated design by automatic high speed highaccuracylinear/turret type die bonding,dispens.ing,visioninspection,automatic cutting clipsystem,vacuum reflow oven that is a perfectreplacement foraluminum wire bonding andcopperwire bonding process, product cycletime and processes wil be reduced and will begreatlyimprove production efficiency.