1.Adopt double-track motor design, the product UPH reaches 100K, and the production efficiency is leading throughout the world;
2.The three-temperature test and high voltage test are realized on the turret mechanism, and the efficiency is higher than that of the translation equipment;
3.A brand-new high-speed test plan for power devices, replacing gravity equipment, won the first national breakthrough award;
4.High-speed IC die bonding equipment UPH 50K, with an accuracy of ±10μm, is the world's leading level;
5.The underlying algorithm and software architec-ture of the equipment are all independentlydeveloped, and the functional extensibility of theproduct is guaranteed.

1.The products may apply to the automotive-grade market and the field of intelligent modules, and the market scale is growing at a high speed;
2.The products have passed the relevant certifications of foreign companies such as the Onsemi and Infineon, with a huge overseas market;
3.The products range from 0.2mm micro-products to 70mm large-scale products, with the most complete categories in the industry;
4.The core parts are designed and manufactured independently, and the product stability is high, with MTBA> 168 hours;
5.It may provide the customers with assembly and test equipment solutions at the same time, being the only one in China.

Industrial Leading Investment Institutions and Head Financial Investment Institutions
Ability to provide the Company with financial, technical, market, talent, management and other support to help the Company grow rapidly.

Ten years focus on the semiconductor equipment forming many barriers.
Young Soul Electronics Technology is one of the earliest enterprises engaged in the manufacture of semiconductor equipment in China.
It has always focused on the development of assembly and tester, and has formed industrial barriers in terms of customers, supply chain, products and services.