Application : Wafers of 12 inches and below

Feature:
High-precision linear motor-driven die bonding head, voice coil motor for precise pressure control;
Die bonding head supports rotation function for angle placement;
Wafer table supports motorized wafer expansion and 360° rotation;
The relative displacement between the ejector pin and the ejector pin cap reduces chip damage, supporting fragile die pickup;
Wide track design compatible with different types of lead frames;
Dual-side solder module supports both solder dotting and solder drawing for enhanced compatibility;
Optional configurations for cassette loading system and stack loading system;
8-zone track design supports temperatures up to 500 degrees.